IEEE Transactions on Components and Packaging Technologies (ERA Journal)

IEEE Transactions on Components and Packaging Technologies is an ERA accredited research journal used as part of the evaluation of the ERA research rankings.

IEEE Transactions on Components and Packaging Technologies issns are issn1: 1521-3331 issn2: 1557-9972.

The fields covered by IEEE Transactions on Components and Packaging Technologies as part of the evaluation of Australian university research excellence are:

Electrical and Electronic Engineering Research Rankings (Sub-Field)

Manufacturing Engineering Research Rankings (Sub-Field)

Other ERA-accredited journals supporting the evaluation of the Electrical and Electronic Engineering field include:

- Acta Automatica Sinica
- Computer Assisted Mechanics and Engineering Sciences
- Electromagnetics
- IEEE Communications Magazine
- IEEE Photonics Journal
- IEEE Transactions on Nanotechnology
- IEEE Transactions on Very Large Scale Integration Systems
- IEEE Transactions on Wireless Communications
- IEEE Wireless Communications Letters
- International Journal of Applied Electromagnetics and Mechanics
- Journal of the Optical Society of America A: Optics Image Science and Vision
- Optical Engineering
- Pattern Recognition
- Signal Processing: Image Communication
- Tohoku Daigaku Dentsu Danwakai Kiroku