Journal of Electronic Packaging (ERA Journal)

Journal of Electronic Packaging is an ERA accredited research journal used as part of the evaluation of the ERA research rankings.

Journal of Electronic Packaging issns are issn1: 1043-7398 issn2: 1528-9044.

The field covered by Journal of Electronic Packaging as part of the evaluation of Australian university research excellence is:

Manufacturing Engineering Research Rankings (Sub-Field)

Other ERA-accredited journals supporting the evaluation of the Manufacturing Engineering field include:

- Advances in Manufacturing
- Asian Journal on Quality
- Australian Journal of Multi-Disciplinary Engineering
- Frontiers of Mechanical Engineering in China
- Human Factors and Ergonomics in Manufacturing
- IEEE Journal of Microelectromechanical Systems
- IEEE Transactions on Components and Packaging Technologies
- IEEE Transactions on Semiconductor Manufacturing
- International Journal of Computational Materials Science and Surface Engineering
- International Journal of Design Engineering
- International Journal of Internet Manufacturing and Services
- International Journal of Machine Tools and Manufacture
- International Journal of Nanomanufacturing
- Plastics Rubber and Composites
- Recent Patents on Nanatechnology

ERA Research Rankings Submenu

- ERA 2018 Outcomes Research Rankings List

- ERA 2018 Research Rankings Analysis

- ERA 2018 Individual University Outcomes List

- ERA List of Research Fields Rankings

- ERA Journal Rankings 2018 List

Latest News and Updates:

- Top 10 Best Australian Universities

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- ERA 2018 Outcomes Research Rankings List

- University Bachelor Degree Completion Rates

- QS Employability Rankings Australian Universities

- ARWU World Rankings of Australian Universities

- Group of Eight (go8) World Rankings

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