Australian University Rankings Guide

Journal of Electronic Packaging (ERA Journal)

Journal of Electronic Packaging is an ERA accredited research journal used as part of the evaluation of the ERA research rankings.

Journal of Electronic Packaging issns are issn1: 1043-7398 issn2: 1528-9044.

The field covered by Journal of Electronic Packaging as part of the evaluation of Australian university research excellence is:

Manufacturing Engineering Research Rankings (Sub-Field)

Other ERA-accredited journals supporting the evaluation of the Manufacturing Engineering field include:

- Advances in Manufacturing
- Bulk Solids and Powder Science and Technology
- CIRP Annals
- IEEE-ASME Transactions on Mechatronics
- International Journal of Cast Metals Research
- International Journal of Electrical Machining
- International Journal of Machining and Machinability of Materials
- International Journal of Manufacturing System Design
- International Journal of Surface Science and Engineering
- Journal of Engineering Materials and Technology
- Journal of Intelligent Manufacturing
- Journal of Materials Science and Technology
- Journal of Micro and Nano-Manufacturing
- Materials and Manufacturing Processes
- Modeling Identification and Control


ERA Research Rankings Submenu


- ERA 2018 Outcomes Research Rankings List

- ERA 2018 Research Rankings Analysis

- ERA 2018 Individual University Outcomes List

- ERA List of Research Fields Rankings

- ERA Journal Rankings 2018 List



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